Complete technical manufacturing specifications for printed circuit boards and assembly at a world-class level.
Complete technical manufacturing specifications for printed circuit boards and assembly at a world-class level.
Up to 40 layers
40+ on request
Gerber 274-X
ODB++, Eagle, DXF, HPGL
535 × 610 mm
0.2 mm — 6.5 mm
0.05 mm — 3.2 mm
≤ 0.75%
¼ oz (9 μm)
up to 11 oz (400 μm)
1.4 oz (50 μm)
| CATEGORY | DESCRIPTION | VALUE |
|---|---|---|
| With Via in Pad | Minimum conductor track width | 0.08 mm |
| With Via in Pad | Minimum trace to trace | 0.08 mm |
| With Via in Pad | Minimum trace to pad | 0.08 mm |
| Without Via in Pad | Minimum conductor track width | 0.06 mm |
| Without Via in Pad | Minimum trace to trace | 0.06 mm |
| Without Via in Pad | Minimum trace to pad | 0.08 mm |
| Annular Ring | Vias / THT | 0.1 mm / 0.125 mm |
| Hole-copper spacing | Drilled & Undrilled | 0.15 mm |
| copper pattern | Minimum Bond width | 0.07 mm (0.0027") |
| TYPE | DESCRIPTION | VALUE |
|---|---|---|
| CNC Mechanical | Minimum through-hole | 0.15 mm |
| CNC Mechanical | Min. blind hole | 0.125 mm |
| CNC Mechanical | Max. through hole | 6.5 mm |
| CNC laser | Minimum laser hole | 0.07 mm |
| CNC laser | Max. laser hole | 0.15 mm |
| Pressfit tolerance | Standard tolerance | ±0.05 mm |
| Blind Holes | aspect ratio | 1:1 |
| Stacked Holes | aspect ratio | 1:1 |
| Blinded Through Buried | aspect ratio | 1:1 |
| Metallization | aspect ratio | 1:12 (opt. 1:16) |
| FINISH | DESCRIPTION | LAYER THICKNESS |
|---|---|---|
| HAL — Lead-free | Hot air leveling, RoHS compliant | 1 – 40 µm |
| HASL — Sn/Pb | Hot air leveling with tin/lead | 1 – 40 µm |
| ENIG | Electroless Nickel Immersion Gold | Ni: 5 µm Au: 0.05-0.1 µm |
| OSP | Organic Solderability Preservative | Available |
| Immersion Silver | Silver direct deposition | Min. 0.3 µm |
| Elyt. Ni/Au hard gold | Galvanically separated | 0.4 – 2 µm |
| CATEGORY | DETAILS | VALUE |
|---|---|---|
| Colors | Green, Black, White, Blue, Red, Yellow, Orange (FLEX) | 7 colors |
| Minimum thickness white/black | 100 µm | |
| Minimum thickness red/blue | 80 µm | |
| Minimum thickness other | 60 µm | |
| Peelable Mask | Color: Blue | Available |
| Covered Bores | IPC-4761 | Type III |
| Filled Holes | IPC-4761 | Type V, VII |
| Graphite resistor | 40 ohms ±5% |
| TREATMENT | TOLERANCE | SPECIAL |
|---|---|---|
| Milling | ±0.1 mm / ±0.07 mm (opt.) | — |
| Scoring | ±0.1 mm | Jump Scoring |
| Deep Milling | ±0.1 mm | — |
| Chamfering | ±0.1 mm | — |
| Edge Plating | Edge coating | Half-bores |
| Backdrill | Pressfit with partial bore | Available |
0.1 mm – 8 mm
50×50 mm (min)
810×710 mm (max)
01005 (min)
55×100×28 mm (max)
≥ 0.35 mm
± 0.025 mm
99.999%
141,000 points/hour
Gerber · BOM
PnP · Assembly Plan
350 mm (selective soldering)
500×450 mm (wave soldering)
< 120 mm
99.999%
2D AOI
Automotive wave soldering system
| PARAMETER | DESCRIPTION | VALUE |
|---|---|---|
| PCBA board size | 50×50 – 390×300 mm | |
| Component size | Chip 01005* to | 60×60 mm |
| Placement accuracy | ±0.025 µm | |
| top space | To the upper stoker | 30 – 60 mm |
| bottom space | To the lower heater | 35 mm |
| STANDARD | SCOPE | CLASS |
|---|---|---|
| IPC-A-600 (current) | Acceptance criteria for printed circuit boards | Grades 2 & 3 |
| IPC-6012 (current) | Qualification and performance standards | Grades 2 & 3 |
| IPC-A-610 (current) | Acceptance standard PCBA | Grades 2 & 3 |
From prototype to series production — PCB and PCBA at world-class level.