Manufacturing Capabilities
Your partner for PCB production & PCBA according to global standards
A look at our PCB & PCBA specifications
From precise track tolerances and complex multilayer structures to high-precision SMT assembly in accordance with current IPC standards - we cover the entire technical spectrum for sophisticated designs. State-of-the-art inspection procedures and certified processes at our sites in Europe and China guarantee the highest quality and reliability.
PCBA
PCB
PCBA
| Specification | Production capacity |
|---|---|
| IPC class | IPC-A-610 Class 2 |
| Minimum panel size | 50 mm × 50 mm |
| Maximum panel size | 710 mm × 810 mm |
| Board Thickness | 0.1 mm - 10.0 mm |
| Manufacturing processes | SMT (single-sided / double-sided), THT & selective soldering |
| SMT component size range | Minimum: 01005; Maximum: 55 mm × 100 mm × 28 mm |
| SMT component pitch | ≥ 0.35 mm |
| DIP component size range | Max. height: < 120 mm |
| Inspection & quality control | FAI (First Article Inspection), SPI, AOI, X-ray, visual inspection |
PCB
| Specification | Production capacity |
|---|---|
| IPC class | IPC-A-600 Class 2 (standard); Class 3 supported |
| Layer count | 1-16 layers (up to 40+ layers available on request) |
| Base materials | FR-4 (Standard, Mid-Tg, High-Tg), Halogen-Free, High-CTI |
| Special substrates | High frequency/low loss (Rogers, Taconic, Isola), metal core (MCPCB) available on request |
| Board Thickness | 0.2 mm - 7.0 mm |
| Maximum panel size | 710 mm × 810 mm |
| Maximum PCB size (working area) | Double-sided: 650 × 1500 mm; Multilayer: 570 × 760 mm |
| Min. track width/spacing | 3 mil / 3 mil (0.075 mm) - based on 1/3 oz to 1/2 oz copper |
| Copper thickness (outer layer, finished) | 0.5 oz to 11 oz (Heavy Copper >3 oz on available request) |
| Copper thickness (inner layer, finished) | 0.5 oz to 10 oz (Heavy Copper >3 oz available on request) |
| Min. laser drilling (microvias) | 4 mil min / 6 mil max (0.10 mm - 0.15 mm) |
| Min. mechanical drill | 4 mil (PTH: 3 mil; NPTH: 2 mil) (≈0.10 mm / 0.075 mm / 0.05 mm) |
| Drilling technology | Blind Vias, Buried Vias, Microvias (Stacked or Staggered) |
| Via protection | Tented, Plugged (Non-conductive Epoxy/Resin), Solder Mask Filled |
| Surface finish | ENIG, ENEPIG, OSP, Immersion Sn, Immersion Ag, Lead-Free HASL, Hard/Soft Gold |
| Solder mask | Green (Matte/Glossy), White, Black, Blue, Red, Yellow |
| Solder stop distance / dam | Min. dam: 2.5 mil (≈0.063 mm) |
| Screen printing inks | White, Yellow, Black |
| Mechanical processing | CNC milling, V-cut, countersinking, chamfering (Goldfinger) available on request |
| Electrical test | 100 % Netlist check (flying probe) |
| Impedance control | ±10 % (standard); ±5 % available on request |
Custom specifications and project-specific requirements available upon request.
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